Plating Technologies for Electronics Packaging
نویسندگان
چکیده
منابع مشابه
Packaging Technologies for High Temperature Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-...
متن کاملEnvironmentally Responsible Electronics Packaging
he United States is running out of T landftlls and that is where most trash, and thus most packaging 1 material, ends up. For example, we generate 180 million tons of solid waste per year, 70% of which goes into landfills. However, in the last 12 years, two-thirds of our landfills have been exhausted. The problem gained national attention in 1989 when a garbage barge from New York wandered acro...
متن کاملHigh Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
متن کاملDie Attach for High Temperature Electronics Packaging
AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...
متن کاملcONSTRICTION/SPREADING RESISTANCE MODEL FOR ELECTRONICS PACKAGING
k thermal conductivity, W/mK An analytical model is developed for predicting constriction and spreading resistances associated with heat transfer from various electronic components under different modes of cooling. The model assumes a heat source in contact with a larger cold plate which is in turn cooled with a convective heat transfer coefficient specified over the sink surface. Unlike existi...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of The Surface Finishing Society of Japan
سال: 2017
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.68.95